c-BN膜の密着性と切削特性 Adhered Property of Cubic Boron Nitride Thin Films and Cutting Property by Cubic Boron Nitride Thin Films

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抄録

  We developed high performance cutting Tools coated c-BN thin films. In the present report , the adhered property of c-BN thin films is depend on bombardment conditions. Important conditions in adhered property are substrate power of Ar bombardment, substrate voltage of Ti ion bombardment and substrate voltage of B layer. As result, better bombard conditions are 290~400 W substrate power in Ar bombardment, -5~-10 V substrate voltage in Ti ion bombard and -5 substrate voltage in B layer. The critical peeling load L of c-BN thin films with this condition is 90N or more. The c-BN thin film with better conditions on end-mill isn't cracked in cutting of S55C.<br>

収録刊行物

  • 真空  

    真空 51(6), 392-396, 2008-06-20 

    The Vacuum Society of Japan

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各種コード

  • NII論文ID(NAID)
    10021157727
  • NII書誌ID(NCID)
    AN00119871
  • 本文言語コード
    JPN
  • 資料種別
    SHO
  • ISSN
    18822398
  • NDL 記事登録ID
    9571198
  • NDL 雑誌分類
    ZN15(科学技術--機械工学・工業--流体機械)
  • NDL 請求記号
    Z16-474
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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