ホウ酸代替物質を使用したスルファミン酸ニッケル浴から得られためっき皮膜物性とその応用 Physical Properties of Deposits Obtaining from Boric Acid Free Sulfamate Ni Bath

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Boric acid has been an essential substance in plating technology for obtaining good film properties and for improving bath life. However, there are restrict ions against Boron in waste water ; therefore the development of a boric acid free nickel electroplating bath was in demanded.</br>In our previous paper, we attempted to develop a boric acid-free sulfamate Ni plating bath. We examined over 20 kinds of plating solutions with alternative chemicals, and found that acetic acid, propionic acid, Ni acetate, and citric acid were recognized as potential candidates to obtain similar film properties and appearance. This paper reports the evaluation of deposited film properties obtained using these four kinds of organic acid baths. Acetic acid, propionic acid, and Ni acetate, as replacements for boric acid, exhibited similar properties as those obtained by boric acid. The propionic acid bath showed less pit defects even after thick film formation without surfactants. Accordingly, it appears to be a favorable boric acid replacement for those applications that require thicker require films.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 59(2), 133-137, 2008-02-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10021169436
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    9370767
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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