書誌事項
- タイトル別名
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- Effect of Magnetic Field on Copper Electroplating-Application to Through-Hole Plating
- ドウ ノ デンキ メッキ ニ オケル ジバ コウカ スルーホール メッキ エノ オウヨウ
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抄録
In a magnetic field, an electrochemical reaction generates a macroscopic solution flow called MHD flow by the Lorentz force, which enhances mass transfer in the diffusion layer (MHD effect). In electroplating, the MHD effect comes from two-dimensional (2D) nucleation in an electrical double layer accompanied by the unstable growth of non-equilibrium fluctuations (called asymmetrical fluctuations). Electroplating under a magnetic field provides the other magnetic field effect called the micro-MHD effect, which emerges with micro-MHD flow and symmetrical non-equilibrium fluctuations in a diffusion layer, and suppresses three-dimensional (3D) nucleation. That is to say, the MHD effect acts as a positive catalyst, whereas the micro-MHD effect is employed as a negative catalyst, or inhibitor. Furthermore, owing to the strong penetration of the magnetic field into the materials, micro-MHD flows are effectively induced even in the inside of a complicated minute structure. Therefore, by controlling the magnetic field, we can expect high quality plating in the through-hole plating. In this paper, along with its application to through-hole plating, copper magneto-electroplating is examined from various aspects.
収録刊行物
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- 表面技術
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表面技術 59 (6), 408-408, 2008
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390001204116620160
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- NII論文ID
- 10021170217
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- NII書誌ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD1cXntVyitr8%3D
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- ISSN
- 18843409
- 09151869
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- NDL書誌ID
- 9531269
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- 抄録ライセンスフラグ
- 使用不可