ゲル粒子を用いた部分置換スズめっき法の開発 Tin Displacement Plating on Copper Using Alginate Gel Particle

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抄録

Tin displacement plating has been used for improvement of soldering adhesion. Conventional displacement plating methods need a masking process for pattern plating. In the present study, we developed a non masking displacement plating method by using an alginate gel particles. A 10×10<sup>−3</sup> cm<sup>3</sup> sodium alginate solution was dropped into an aqueous solution containing 5 wt% tin sulfate and 0.83 mol dm<sup>−3</sup> thiourea by using a microsyringe. The spherical gel particles were prepared by crosslinking between alginate and Sn<sup>2+</sup>. The average diameter of the gel particles was about 2 mm. A copper sheet was used as a substrate. An alginate gel particle containing electrolytes was attached to the copper surface and left for 30 min at 25°C. A circular tin film formed on the copper substrate with high uniformity and a sharp edge line. The diameter and thickness of the tin film was about 450 μm and 0.4 μm respectively.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 59(6), 415-419, 2008-06-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10021170244
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    9531291
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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