Tin Displacement Plating on Copper Using Alginate Gel Particle
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- SHITANDA Isao
- Faculty of Science and Technology, Tokyo University of Science
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- KAWANO Takehiko
- Faculty of Science and Technology, Tokyo University of Science
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- ITAGAKI Masayuki
- Faculty of Science and Technology, Tokyo University of Science
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- WATANABE Kunihiro
- Faculty of Science and Technology, Tokyo University of Science
Bibliographic Information
- Other Title
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- ゲル粒子を用いた部分置換スズめっき法の開発
- ゲル リュウシ オ モチイタ ブブン チカン スズ メッキホウ ノ カイハツ
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Abstract
Tin displacement plating has been used for improvement of soldering adhesion. Conventional displacement plating methods need a masking process for pattern plating. In the present study, we developed a non masking displacement plating method by using an alginate gel particles. A 10×10−3 cm3 sodium alginate solution was dropped into an aqueous solution containing 5 wt% tin sulfate and 0.83 mol dm−3 thiourea by using a microsyringe. The spherical gel particles were prepared by crosslinking between alginate and Sn2+. The average diameter of the gel particles was about 2 mm. A copper sheet was used as a substrate. An alginate gel particle containing electrolytes was attached to the copper surface and left for 30 min at 25°C. A circular tin film formed on the copper substrate with high uniformity and a sharp edge line. The diameter and thickness of the tin film was about 450 μm and 0.4 μm respectively.
Journal
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- Journal of The Surface Finishing Society of Japan
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Journal of The Surface Finishing Society of Japan 59 (6), 415-419, 2008
The Surface Finishing Society of Japan
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Details 詳細情報について
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- CRID
- 1390282679093331584
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- NII Article ID
- 10021170244
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- NII Book ID
- AN1005202X
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- COI
- 1:CAS:528:DC%2BD1cXntVyitrw%3D
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- ISSN
- 18843409
- 09151869
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- NDL BIB ID
- 9531291
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed