Technology for Embedding Capacitors on Printed Wiring Board Using Aerosol Deposition

• IMANAKA Y.

Journal

• Proc. of Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2006), April 24th, 2006, Grand Hyatt Hotel Denver, Colorado

  Proc. of Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2006), April 24th, 2006, Grand Hyatt Hotel Denver, Colorado 2006

Details

• CRID: 1570009750682961024
• NII Article ID: 10021918013
• Data Source:
  • CiNii Articles