CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density
-
- FURUSAWA T.
- Renesas Technology Corp.
-
- KODAMA D.
- Renesas Technology Corp.
-
- MIYAZAKI H.
- Renesas Technology Corp.
-
- MATSUMOTO M.
- Renesas Technology Corp.
-
- IZUMITANI J.
- Renesas Technology Corp.
-
- MATSUMOTO H.
- Renesas Technology Corp.
-
- FUKUI S.
- Renesas Technology Corp.
-
- HASHIMOTO K.
- Renesas Technology Corp.
-
- TAWA S.
- Renesas Technology Corp.
-
- OKADA M.
- Renesas Technology Corp.
-
- TOMITA K.
- Renesas Technology Corp.
-
- NAGAKI Y.
- Renesas Technology Corp.
-
- MINOURA Y.
- Renesas Technology Corp.
-
- ISHII A.
- Renesas Technology Corp.
-
- AMOU N.
- Renesas Technology Corp.
-
- MORI K.
- Renesas Technology Corp.
-
- MAEKAWA K.
- Renesas Technology Corp.
-
- SUZUMURA N.
- Renesas Technology Corp.
-
- HONDA K.
- Renesas Technology Corp.
-
- HIROSE Y.
- Renesas Technology Corp.
-
- OSAKI A.
- Renesas Technology Corp.
この論文をさがす
収録刊行物
-
- Extended abstracts of the ... Conference on Solid State Devices and Materials
-
Extended abstracts of the ... Conference on Solid State Devices and Materials 2006 1012-1013, 2006-09-13
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1574231875369260288
-
- NII論文ID
- 10022547462
-
- NII書誌ID
- AA10777858
-
- 本文言語コード
- en
-
- データソース種別
-
- CiNii Articles