Effect of Bonding Conditions on Joints in Anodic Bonding of Borosilicate Glass to Silicon

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  • Okada Hideki
    Graduate School of Science and Technology, Niigata University Industrial Research Institute of Niigata Prefecture
  • Oya Kazuhiro
    Graduate School of Science and Technology, Niigata University
  • Takagi Hideki
    National Institute of Advanced Industrial Science and Technology
  • Ohashi Osamu
    Graduate School of Science and Technology, Niigata University

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Other Title
  • シリコンとホウケイ酸ガラスの陽極接合部に及ぼす接合条件の影響
  • シリコン ト ホウケイサン ガラス ノ ヨウキョク セツゴウブ ニ オヨボス セツゴウ ジョウケン ノ エイキョウ

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Abstract

  Since Anodic bonding of silicon to glass is solid state bonding, it is often used as a MEMS manufacturing technology when accuracy of dimensions is required. However, it is necessary to clarify the relation between bonding conditions or glass compositions and the mechanical properties of anodically bonded joints such as tensile strength and fracture mode. The influence of environmental factors such as high temperature and high humidity on the joints is also not well understood. This study was conducted to investigate the influence of bonding conditions on mechanical properties and on growth of the reaction layer at the bond interface. Moreover, since the transfer of electric charge in the bond interface is likely to be closely related to the anodic bonding reaction, the bonding charge density which flowed into the bond interface was measured during the bonding process, and the relation between the bonding charge density and the tensile strength or the reaction layer was examined.<br>   At bonding temperatures below 300°C, tensile strength increased with the bonding time and bonding voltage. At bonding temperatures above 350°C, increasing the bonding time and bonding voltage did not influence tensile strength. At bonding conditions of low charge density, the observed fracture mode was interface fracture. As the bonding charge was increased, tensile strength was stabilized and the fracture mode changed to glass fracture. As the bonding charge density was increased, the reaction layer became thicker, and growth of the reaction layer was controlled by the bonding charge density. There was a tendency towards greater tensile strength with thicker reaction layers. Thus, measuring boding charge during the bonding process helped to clarify the effect of bonding conditions on the joints.<br>

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