Solderability of Bulk Metallic Glasses Using Lead-Free Solders

• Nishikawa Hiroshi

  Joining and Welding Research Institute, Osaka University

• WongPiromsarn Krit

  Graduate School of Engineering, Osaka University

• Abe Hiroya

  Joining and Welding Research Institute, Osaka University

• Takemoto Tadashi

  Joining and Welding Research Institute, Osaka University

• Fukuhara Mikio

  Institute for Materials Research, Tohoku University

• Inoue Akihisa

  Institute for Materials Research, Tohoku University

抄録

A feasibility study has been conducted to determine whether the low temperature joining process such as soldering process and wire bonding process can be applied to join a bulk metallic glass (BMG) to a BMG and a BMG to a crystalline metal. Therefore, in order to evaluate the solderability of BMGs, the spread test of the solder was basically performed for three kind of BMGs in this study. As a result, Pd-based BMG exhibited a good wetting behavior of the solder at 503 K and 523 K. On the other hand, concerning Cu-based and Zr-based BMGs, there was no wetting of the solder on the surface of BMGs regardless of the peak temperature. Then the ultrasonic soldering process was tested to establish the joint process for BMGs. It was clear that the application of ultrasonic is effective to the soldering process.

収録刊行物

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 50 (6), 1326-1329, 2009

  公益社団法人 日本金属学会

キーワード

• bulk metallic glass
• lead-free solder
• solderability
• wetting behavior
• ultrasonic soldering
• intermetallic compound

詳細情報

• CRID: 1390282679227030528
• NII論文ID: 10024815749
• NII論文ID: 130004454284
• NII書誌ID: AA1151294X
• DOI: 10.2320/matertrans.me200824
• ISSN: 13475320
• ISSN: 13459678
• NDL書誌ID: 10237109
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I10237109
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/50/6/50_ME200824/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可