Study on the Luminous and Thermal Characteristics of High-Power Near-Ultraviolet LED Packages with Various Chip Arrangements
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- KAMON Kunihito
- Graduate School of Science and Engineering, Yamaguchi University
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- TAKESHITA Junichi
- Graduate School of Science and Engineering, Yamaguchi University
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- FUKUI Tsuyoshi
- Graduate School of Science and Engineering, Yamaguchi University
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- MIYACHI Tsutomu
- Graduate School of Science and Engineering, Yamaguchi University
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- UCHIDA Yuji
- Faculty of Engineering, Yamaguchi University
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- KURAI Satoshi
- Graduate School of Science and Engineering, Yamaguchi University
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- TAGUCHI Tsunemasa
- Graduate School of Science and Engineering, Yamaguchi University
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High-power light-emitting diodes (LEDs) have been fabricated through multi-chip integration of small near-ultraviolet (n-UV) LED chips by using a direct flip-chip bonding technique. Based on optical measurements, the absorption of light between adjoining LED chips was not observed when temperature was held constant, although the luminescence characteristics of the LED decreased with increasing package temperature. Large-scale integration LEDs (LSILEDs) with radiant fluxes over 2 W and 121 LED chips in a single package were fabricated. Four types of packages with different chip densities revealed the importance of thermal management through the control of the number and density of the LED chips in order to obtain high radiant flux and high efficiency.
収録刊行物
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- Journal of Light & Visual Environment
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Journal of Light & Visual Environment 33 (3), 142-146, 2009
一般社団法人 照明学会
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詳細情報
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- CRID
- 1390282679592848896
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- NII論文ID
- 10025970352
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- NII書誌ID
- AA00258424
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- ISSN
- 13498398
- 03878805
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可