鉛フリー半導体パッケージのはんだ付け実装におけるウィスカ評価  [in Japanese] Whisker Test of Lead-Free Semiconductor Packages in Lead-Free Soldering  [in Japanese]

Abstract

We evaluated the semiconductor mounting substrate and investigated the whiskers generations and factors by experimenting different environmental conditions. On the lead consisted of Cu base/Sn plating, the result of the condition 110°C/85% & 120°C/85% which were produced by Air-HAST (HAST with air) generates Sn whiskers faster than other high temperature and humidity tests. We concluded that the factors in the whisker generation are high temperatures, high moisture and oxygen.

Journal

Journal of Japan Institute of Electronics Packaging  

Journal of Japan Institute of Electronics Packaging 13(1), 71-77, 2010-01-01 

Japan Institute of Electronics Packaging

References:  3

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Codes

  • NII Article ID (NAID) :
    10025984510
  • NII NACSIS-CAT ID (NCID) :
    AA11231565
  • Text Lang :
    JPN
  • Article Type :
    ART
  • ISSN :
    13439677
  • NDL Article ID :
    10549764
  • NDL Source Classification :
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No. :
    Z74-B258
  • Databases :
    CJP  NDL  J-STAGE 

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