抄録
We evaluated the semiconductor mounting substrate and investigated the whiskers generations and factors by experimenting different environmental conditions. On the lead consisted of Cu base/Sn plating, the result of the condition 110°C/85% & 120°C/85% which were produced by Air-HAST (HAST with air) generates Sn whiskers faster than other high temperature and humidity tests. We concluded that the factors in the whisker generation are high temperatures, high moisture and oxygen.
収録刊行物
- エレクトロニクス実装学会誌 = Journal of Japan Institute of Electronics Packaging
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エレクトロニクス実装学会誌 = Journal of Japan Institute of Electronics Packaging 13(1), 71-77, 2010-01-01
社団法人 エレクトロニクス実装学会