マイクロメートルサイズの酸化銀粒子を用いた高温環境向け鉛フリー接合技術の開発  [in Japanese] Development of Lead Free Bonding Technique Corresponding to High Temperature Environment Using Micro-scaled Silver-oxide Particles  [in Japanese]

Journal

Materia Japan  

Materia Japan 49(1), 20-22, 2010-01-01 

日本金属学会

References:  4

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Codes

  • NII Article ID (NAID) :
    10026268224
  • NII NACSIS-CAT ID (NCID) :
    AN10433227
  • Text Lang :
    JPN
  • Article Type :
    NOT
  • ISSN :
    13402625
  • NDL Article ID :
    10545635
  • NDL Source Classification :
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No. :
    Z17-313
  • Databases :
    CJP  NDL 

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