Effects of Silver Coating Covered with Copper Filler on Electrical Resistivity of Electrically Conductive Adhesives

• Nishikawa Hiroshi

  Joining and Welding Research Institute, Osaka University

• Mikami Saya

  Graduate School of Engineering, Osaka University

• Miyake Koichi

  Mitsui Mining & Smelting Co., Ltd.

• Aoki Akira

  Hikoshima Smelting Co., Ltd.

• Takemoto Tadashi

  Joining and Welding Research Institute, Osaka University

抄録

Electrically conductive adhesives (ECAs) are usually composed of conductive metal fillers and polymeric resin. For the metals fillers, silver is the most commonly used due to its high electrical and thermal conductivities, and chemical stability. Recently copper can be a promising candidate for conductive filler metal due to its low resistivity, low cost and good electro-migration performance. In this study, to overcome the problem of high electrical resistance associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. In particular, the effect of silver coating on the electrical resistivity of ECAs just after curing and after reliability tests was investigated. It was found that the electrical resistivity of ECA using silver-coated copper filler was much lower and more stable than that of ECA using pure copper filler after curing and after reliability tests.

収録刊行物

• MATERIALS TRANSACTIONS

  MATERIALS TRANSACTIONS 51 (10), 1785-1789, 2010

  公益社団法人 日本金属学会

キーワード

• copper filler
• electrically conductive adhesive
• silver coating
• electrical resistivity
• oxidation

詳細情報

• CRID: 1390282679226308736
• NII論文ID: 10026695226
• NII書誌ID: AA1151294X
• DOI: 10.2320/matertrans.mj201020
• ISSN: 13475320
• ISSN: 13459678
• NDL書誌ID: 10831533
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I10831533
• Web Site: https://www.jstage.jst.go.jp/article/matertrans/51/10/51_MJ201020/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可