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This paper reports a novel silicon bulk-micromachining process using deep reactive ion etching (DRIE) of silicon and electroplating of gold in order to realize a low-loss radio frequency (RF) waveguide. The waveguide developed in the handle wafer was electrically isolated by air, laterally actuated to close metal-to-metal contacts, and driven by an electrostatic actuator integrated on the SOI sides by the layer-separation technique. A thinned silicon-on-insulator (SOI) wafer of high-resistive handle layer and low-resistive active layer was chosen to meet the process and design requirements for a compact low loss switch.
- IEEJ Transactions on Sensors and Micromachines
IEEJ Transactions on Sensors and Micromachines 131(3), 130-131, 2011-03-01
The Institute of Electrical Engineers of Japan