Highly Reliable CO<sub>2</sub> Laser VIA Hole Drilling Technology by In-site Process Monitoring

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  • Tanaka Ken-ichiro
    Advanced Technologies Development Laboratory, Panasonic Electric Works Co., Ltd.
  • Kubo Masao
    Micro Fabrication Process Development Center, Panasonic Electric Works Co., Ltd.
  • Uchida Yuichi
    New Product Technologies Development Department, Panasonic Electric Works Co., Ltd.
  • Miyamoto Isamu
    Osaka University

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  • インプロセスモニタリングを用いたCO<sub>2</sub>レーザによるVIAホールの高信頼加工技術
  • インプロセスモニタリング オ モチイタ CO ₂ レーザ ニ ヨル VIA ホール ノ コウシンライ カコウ ギジュツ

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Abstract

For VIA hole drilling into printed-wiring boards using a CO2 laser, one of the critical issues is some insufficient electrical conduction by the thin layer of residual resin, so-called “smear,” on the inner circuits after the drilling. In general, smear over 2 μm thick cannot be removed by a chemical etching process. In this study, a novel in-situ process monitoring technology for laser drilling was developed to overcome this issue. During the laser drilling process, the amount of smear can be estimated by detecting the light emission generated from the reductive reaction of copper oxide on the inner circuits. Depending on the thickness of the smear, the number of laser pulses is controlled to keep it below 2 μm. This technology enables a VIA hole drilling system with high reliability.

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