書誌事項
- タイトル別名
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- Influence of Substrate Surface Shape on Peel-off Strength between Aluminum Nitride Substrates and an Epoxy Modified Polyimide Adhesive.
- エポキシ ヘンセイ ポリイミドケイ セッチャクザイ ノ ヒキハガシ キョウド ニ オヨボス チッカ アルミニウム キバン ノ ヒョウメン ケイジョウ ノ エイキョウ
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抄録
Adhesion between aluminum nitride (AlN) substrates and plastic parts has an important bearing on the development of the plastic and AlN laminated package. This paper reports the influence of surface shape of A1N substrates on peel-off strength between an epoxy modified polyaminobismaleimide adhesive and the substrates. Although peel-off strength increased when the surface became rougher, values differed according to surface treatment method. Surface roughness of each AlN grain, which showed nanometer order, contributes to the increase of peel-off strength. The change of substrate surface to oxidized phase will also contribute to an increase in peel-off strength. Moreover, decrease of non-polar carbon hydride on the substrate surface facilitates an increase in peel-off strength.
収録刊行物
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- エレクトロニクス実装学会誌
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エレクトロニクス実装学会誌 3 (6), 494-500, 2000
一般社団法人エレクトロニクス実装学会
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詳細情報 詳細情報について
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- CRID
- 1390001204560345600
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- NII論文ID
- 130004062852
- 110001238225
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- NII書誌ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL書誌ID
- 5467330
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可