書誌事項
- タイトル別名
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- Development of Directionally Aligned SiC Whisker Grinding Wheel. Manufacturing Process of Resinoid Grinding Wheel and Ground Surface Roughness.
- ホウコウ オ ソロエタ タンカ ケイソ ウィスカ トイシ ノ カイハツ レジノ
- Manufacturing Process of Resinoid Grinding Wheel and Ground Surface Roughness
- レジノイド砥石の製作と仕上面粗さ
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This paper deals with the development of a grinding wheel of resinoid segments with a very fine SiC whiskers as an abrasive. The whiskers (diameter of about 1 μm, length of 40-50 μm) are directionally aligned and normal to the grinding surface. The alignment of the SiC whiskers and the surface roughness of the ground surfaces are examined. The results show that a smooth surface with a roughness value of Rmax=0.04 μm (Ra =0.004 μm) is obtained for ground hardened die steel.
収録刊行物
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- 精密工学会誌
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精密工学会誌 59 (5), 791-796, 1993
公益社団法人 精密工学会
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詳細情報 詳細情報について
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- CRID
- 1390001204763800832
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- NII論文ID
- 110001367383
- 10003130017
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- NII書誌ID
- AN1003250X
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- ISSN
- 1882675X
- 09120289
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- NDL書誌ID
- 3822522
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- 抄録ライセンスフラグ
- 使用不可