方向をそろえた炭化けい素ウィスカ砥石の開発 レジノイド砥石の製作と仕上面粗さ

書誌事項

タイトル別名
  • Development of Directionally Aligned SiC Whisker Grinding Wheel. Manufacturing Process of Resinoid Grinding Wheel and Ground Surface Roughness.
  • ホウコウ オ ソロエタ タンカ ケイソ ウィスカ トイシ ノ カイハツ レジノ
  • Manufacturing Process of Resinoid Grinding Wheel and Ground Surface Roughness
  • レジノイド砥石の製作と仕上面粗さ

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抄録

This paper deals with the development of a grinding wheel of resinoid segments with a very fine SiC whiskers as an abrasive. The whiskers (diameter of about 1 μm, length of 40-50 μm) are directionally aligned and normal to the grinding surface. The alignment of the SiC whiskers and the surface roughness of the ground surfaces are examined. The results show that a smooth surface with a roughness value of Rmax=0.04 μm (Ra =0.004 μm) is obtained for ground hardened die steel.

収録刊行物

  • 精密工学会誌

    精密工学会誌 59 (5), 791-796, 1993

    公益社団法人 精密工学会

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