X線式はんだ付検査装置の開発

書誌事項

タイトル別名
  • Automatic Solder Joint Inspection System by X-ray Imaging.
  • Xセンシキ ハンダズケ ケンサ ソウチ ノ カイハツ

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抄録

This paper describes an automatic solder joint inspection system by X-ray imaging. The following were developed for highly reliable inspection of J-lead and gull-wing lead solder joints : (1) An automatic inspection method for double side-mounted PCBs (Printed Circuit Boards) by micro-focus X-ray imaging and board tilting, (2) Enhancement of X-ray image of solder joints by logarithmic transformation of a detected image, (3) Fillet judgement by comparison between a detected image and a number of typical nondefective images selected by a clustering procedure, (4) Bridge determination by multi-step thresholding and comparison between pattern frequency distribution of a detected image and that of a nondefective image. The inspection system developed with these technologies had a defect detection rate of 100% with the smallest detectable defect being 50 μm.

収録刊行物

  • 精密工学会誌

    精密工学会誌 59 (1), 65-71, 1993

    公益社団法人 精密工学会

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