書誌事項
- タイトル別名
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- Automatic Solder Joint Inspection System by X-ray Imaging.
- Xセンシキ ハンダズケ ケンサ ソウチ ノ カイハツ
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抄録
This paper describes an automatic solder joint inspection system by X-ray imaging. The following were developed for highly reliable inspection of J-lead and gull-wing lead solder joints : (1) An automatic inspection method for double side-mounted PCBs (Printed Circuit Boards) by micro-focus X-ray imaging and board tilting, (2) Enhancement of X-ray image of solder joints by logarithmic transformation of a detected image, (3) Fillet judgement by comparison between a detected image and a number of typical nondefective images selected by a clustering procedure, (4) Bridge determination by multi-step thresholding and comparison between pattern frequency distribution of a detected image and that of a nondefective image. The inspection system developed with these technologies had a defect detection rate of 100% with the smallest detectable defect being 50 μm.
収録刊行物
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- 精密工学会誌
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精密工学会誌 59 (1), 65-71, 1993
公益社団法人 精密工学会
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詳細情報
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- CRID
- 1390282679741774208
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- NII論文ID
- 110001371172
- 10003991048
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- NII書誌ID
- AN1003250X
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- ISSN
- 1882675X
- 09120289
- http://id.crossref.org/issn/09120289
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- NDL書誌ID
- 3812341
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可