書誌事項
- タイトル別名
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- Comparison of BGA Jointing Property of Sn-Ag and Sn-Ag-Cu Solder Balls on EN/IG Finished Boards.
- ムデンカイ Ni Au ショリ キバン エ ノ Sn Ag オヨビ Sn Ag Cu ハンダ ボール ノ BGA セツゴウセイ ヒカク
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BGA joints of Sn-3.5Ag and Sn-3.5Ag-0.75Cu lead-free solders on the substrates plated by Electroless Nickel/Immersion Gold were studied. Solder ball pull strength was measured by hot bump pull method, and it is found that the pull strength of Sn-3.5Ag-0.75Cu was higher than that of Sn-3.5Ag. P-rich layer was observed at the jointed interface by cross-section analysis using EPMA. The P-rich layer of Sn-3.5Ag-0.75Cu was thinner than that of Sn-3.5Ag. In the case of Sn-3.5Ag-0.75Cu, intermetallic compounds (Cu, Ni) 6Sn5 were formed, and they prevented the diffusion of Ni to solders, and inhibited the concentration of P at the jointed interface. As the result, P-rich layer was hardly formed, and this is considered to be a reason for high pull strength of Sn-3.5Ag-0.75Cu solders.
収録刊行物
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- エレクトロニクス実装学会誌
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エレクトロニクス実装学会誌 5 (3), 272-277, 2002
一般社団法人エレクトロニクス実装学会
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詳細情報 詳細情報について
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- CRID
- 1390282679537586816
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- NII論文ID
- 130004165953
- 110001716477
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- NII書誌ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL書誌ID
- 6156282
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
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- 抄録ライセンスフラグ
- 使用不可