一方向強化CFRP積層板の繰返し荷重下における層間はく離進展に及ぼす試験温度および荷重繰返し周波数の影響  [in Japanese] Effects of Frequency and Temperature on Delamination Crack Growth of Unidirectional CFRP under Cyclic Loading  [in Japanese]

Abstract

The effects of frequency and temperature on the delamination crack growth under cyclic loading were investigated with unidirectional CF/epoxy laminates. Tests were conducted at room temperature, 50℃, and 80℃ in air with double contilever beam (DCB) specimens. At room temperature, the growth rate in terms of number of cylces, da/dN, was given by a power function of the stress intensity range, ΔK, when da/dN was larger than 5×10^<-9>(m/cycle). The relation was almost independent of the loading frequency. At 50゜C and 80゜C, the growth rate in terms of number of cycles, da/dN, was given by a power function of the stress intensity range, ΔK, when da/dN was larger than 5×10^<-11> (m/cycle). When compared at the same value of ΔK, the growth rate, da/dN was higher for higher temperature and for lower frequency. However, the growth rate expressed in terms of time, da/dt, was found to be controlled by the maximum stress intensity factor, K_<max>, independent of the loading frequency at the same temperature, I. E., the delamination crack was considered to have grown by time dependent mechanisms under cyclic loading. The da/dt-K_<max> relation also depended on temperature. For higher temperature, the growth rate, da/dt, was higher at the same value of K_<max>.

Journal

Journal of the Society of Materials Science, Japan   [List of Volumes]

Journal of the Society of Materials Science, Japan 42(475), 384-390, 1993-04-15  [Table of Contents]

The Society of Materials Science, Japan

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Codes

  • NII Article ID (NAID) :
    110002298914
  • NII NACSIS-CAT ID (NCID) :
    AN00096175
  • Text Lang :
    JPN
  • ISSN :
    05145163
  • NDL Article ID :
    3818590
  • NDL Source Classification :
    工業材料・材料試験
  • NDL Source Classification :
    ZM16(科学技術--科学技術一般--工業材料・材料試験)
  • NDL Call No. :
    Z14-267
  • Databases :
    NDL  NII-ELS  Journal@rchive