B15-012 APPLICATION OF THERMAL FLOW SIMULATION TO SWITCH MODE POWER SUPPLY DESIGN :

• Koizumi,Katsuhiro

  Department of Design Engineering, COSEL Co., Ltd.

• Joboji,Akito

  Department of Design Engineering, COSEL Co., Ltd.

• Nagahara,Kuniaki

  Department of Design Engineering, COSEL Co., Ltd.

• Ishizuka,Masaru

  Department of Mechanical systems Engineering, Toyama Prefectural University

Abstract

This paper describes an application example of thermal flow simulation to the design of a switch mode power supply (SMPS) that is natural convection air-cooled. In this analysis, the modeling of printed circuit board (PCB) and power semiconductor devices was examined using the design of experiments method. The PCB was treated as a simple plate, and average thermal conductivity was not considered. The power semiconductor devices were modeled as a simple hexahedral resistive network block. As the heat generation sources, a field effect transistor (FET) and a diode were considered in the simulation, and the calculation method of power loss is described. The difference between measured and calculated values for power semiconductor devices was found to be within approximately 10K.

Journal

• International Symposium on Micro-Mechanical Engineering : ISMME

  International Symposium on Micro-Mechanical Engineering : ISMME 2003 222-228, 2003-11-30

  日本機械学会

Keywords

• Electronic equipment
• Electronic devices
• Swith mode power supply

Details

• CRID: 1542543045137264000
• NII Article ID: 110002344871
• NII Book ID: AA11903244
• Web Site: http://dl.ndl.go.jp/info:ndljp/pid/10351082
• Text Lang: en
• Data Source:
  • NDL-Digital
  • CiNii Articles