Bonding Strength Evaluation of a Metal-Resin Adhering Interface Formed by Resin Molding

• SAKATA Sohji

• HATTORI Toshio

• HATSUDA Toshio

抄録

Bonding strength of a metal (Fe-Ni alloy) and resin (epoxy base) adhering interface was examined under thermal stress occurring in the cooling process of the thermoset resin after adhesion. Thermal stresses on the adhering interface were calculated using the finite element method. Calculated stresses and the experimental strength were compared. The following results were obtained. Bonding strength of a metal and resin adhering interface under thermal loads can be estimated mainly by using shearing stress on the adhering interface (τ_yz) ; an accurate strength estimation can be obtained by taking into account the normal stress on the adhering interface (σ_z).

収録刊行物

• JSME international journal. Ser. 1, Solid mechanics, strength of materials

  JSME international journal. Ser. 1, Solid mechanics, strength of materials 31 (3), 569-574, 1988

  一般社団法人 日本機械学会

キーワード

• Bonding Strength
• Thermal Stress
• Debonding
• Shearing Stress
• Normal Stress

詳細情報

• CRID: 1390282680410098560
• NII論文ID: 110002348451
• NII書誌ID: AA10680585
• DOI: 10.1299/jsmea1988.31.3_569
• ISSN: 09148809
• Web Site: https://www.jstage.jst.go.jp/article/jsmea1988/31/3/31_3_569/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可