210 スペックル法による混合モード試験片内部の応力解析(OS6-2 光学的手法I)(OS6 実験力学の新展開)

• 町田 賢司

  東理大

• 碓井 健司

  東理大院

• 岡村 弘之

  東理大

書誌事項

タイトル別名

• 210 Stress Analysis inside the Specimen under Mixed-Mode Loading by Speckle Photography

抄録

The point by point measurement of in-plane displacement was conducted by the pointwise filtering approach of speckle photography. The experiment was conducted on the compact normal and shear (CNS) specimen made of acrylic resin subjected to various kinds of mixed-mode loading. Displacement field inside specimen was measured under various kinds of mixed-mode loading. Then, stress-intensity factors of asymptotic solution derived by Sun and Jih were estimated using the displacement data obtained from speckle photography by the least squares method. The experimental results were compared with the numerical results. The variation of stress-intensity factors with load application angle was discussed on different planes from the free surface to the center of the specimen.

収録刊行物

• 材料力学部門講演会講演論文集

  材料力学部門講演会講演論文集 2001 (0), 135-136, 2001

  一般社団法人 日本機械学会

キーワード

• Speckle photography
• Stress intensity factor
• Mixed-mode
• Virtual crack extension method

詳細情報

• CRID: 1390282681044131072
• NII論文ID: 110002486755
• DOI: 10.1299/jsmezairiki.2001.0_135
• ISSN: 24331287
• Web Site: https://www.jstage.jst.go.jp/article/jsmezairiki/2001/0/2001_135/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可