210 スペックル法による混合モード試験片内部の応力解析(OS6-2 光学的手法I)(OS6 実験力学の新展開)  [in Japanese] 210 Stress Analysis inside the Specimen under Mixed-Mode Loading by Speckle Photography  [in Japanese]

The point by point measurement of in-plane displacement was conducted by the pointwise filtering approach of speckle photography. The experiment was conducted on the compact normal and shear (CNS) specimen made of acrylic resin subjected to various kinds of mixed-mode loading. Displacement field inside specimen was measured under various kinds of mixed-mode loading. Then, stress-intensity factors of asymptotic solution derived by Sun and Jih were estimated using the displacement data obtained from speckle photography by the least squares method. The experimental results were compared with the numerical results. The variation of stress-intensity factors with load application angle was discussed on different planes from the free surface to the center of the specimen.