441 落下衝撃時の基板の動的特性がはんだ接合部に及ぼす影響(GS-9 センサ・電子デバイス)  [in Japanese] 441 The Effect of The Dynamic Characteristic in The Falling and Impact on Solder Joints  [in Japanese]

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Keywords

• FEM
• Solder Joint
• BGA Package
• Dynamic Analysis
• Response Analysis
• LS-DYNA
• NASTRAN

Codes

• NII Article ID (NAID) :

  110002487059

• NII NACSIS-CAT ID (NCID) :

  AA11902139

• Text Lang :

  JPN

• Databases :

  NII-ELS