457 非定常熱応力下ICパッケージの破壊力学パラメータの評価(GS-12 き裂(3))  [in Japanese] 457 Evaluation of Fracture Mechanics Parameters of IC Packages Subjected to Non-steady Thermal Stress  [in Japanese]

Journal

Proceedings of the ... annual meeting of JSME/MMD   [List of Volumes]

Proceedings of the ... annual meeting of JSME/MMD 2001, 465-466, 2001-07-19  [Table of Contents]

The Japan Society of Mechanical Engineers