320 熱負荷を受ける傾斜機能平板のき裂進展挙動に関する研究

• 山本 記之

  静大

• 野田 直剛

  静大

• 石原 正行

  静大

書誌事項

タイトル別名

• CRACK GROWTH IN FUNCTIONALLY GRADED MATERIAL UNDER THERMAL SHOCK

抄録

This paper examines the problem of thermal cracking under a transient temperature field in a ceramic/metal functionally graded plate. When the functionally graded plate is cooled from high temperature, it could be observed that curved or stright multiple cracks occur on the ceramic surface. In addition, those multiple cracks influence each other and form complex arrays. To investigate mutual effect among multiple cracks, crack paths are simulated using finite element method. Transient thermal stress field and crack growth are treated as a linear quasi-static thermoelastic problem for a plane strain state.

収録刊行物

• 材料力学部門講演会講演論文集

  材料力学部門講演会講演論文集 2002 (0), 257-258, 2002

  一般社団法人 日本機械学会

キーワード

• Multiple Crack Growth
• Functionally Graded Plate
• Thermal Shock
• Finite Element Method

詳細情報

• CRID: 1390282681044062976
• NII論文ID: 110002488213
• NII書誌ID: AA11902139
• DOI: 10.1299/jsmezairiki.2002.0_257
• ISSN: 24331287
• HANDLE: 10297/2172
• Web Site: https://shizuoka.repo.nii.ac.jp/records/1573
• Web Site: https://www.jstage.jst.go.jp/article/jsmezairiki/2002/0/2002_257/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • IRDB
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可