1206 金属成形金型内蔵マイクロセンサーの開発に関する研究

• 任 均謀

  都立大

• 楊 明

  都立大

書誌事項

タイトル別名

• Development of micro-sensor embedded in die for metal forming

抄録

Using semiconductor processing technology, micro-sensor which embedded in die was fabricated, and a measurement system with a wireless signal processing unit to measure deformation information that is difficult to get directly in metal forming was developed. In this paper, we applied the sensing system to V-bending process by embedding the micro sensor unit into die to get the information of strain distribution, and by this way, the load and the angle during the processing could be measured with high precision.

収録刊行物

• 年次大会講演論文集

  年次大会講演論文集 2003.1 (0), 457-458, 2003

  一般社団法人 日本機械学会

キーワード

• embedded micro sensor
• strain distribution
• semiconductor strain gauge
• the load or the angle

詳細情報

• CRID: 1390001206059420800
• NII論文ID: 110002525061
• DOI: 10.1299/jsmemecjo.2003.1.0_457
• ISSN: 24331325
• Web Site: https://www.jstage.jst.go.jp/article/jsmemecjo/2003.1/0/2003.1_457/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可