1115 多層サブミクロン膜のコーナー部からのはく離発生条件  [in Japanese] Interface strength between sub-micron films from the corner  [in Japanese]

The effect of three-dimensional structure on the interface strength at the edge point between submicron films was examined. The test was carried out for the test piece in which the effect of the three-dimensional shape appeared strongly for opening mode testing method. The interface cracking initiates at the point of the edge between Si_3N_4 and Cu films. By using sub-modeling method of FEM, the singularity field in the vicinity of the corner point is revealed. On the basis of fracture mechanics concept, the interface fracture toughness is determined. By the effect of the three-dimensional shape, the possibility in which the fracture mode changed was shown.