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Abstract
The deformation measuring method for solder parts in electronic products is needed for strength and reliability estimation. An electromotive force in deformation of solder part was generated and measured successfully by a thermo-couple. And its possibility as a measuring method of deformation was shown. But, there needs more detail experiment and data for making it be an effective and usable method for measuring deformation. Therefore, stress-strain curve and electromotive force were measured in tension test using solder wire sample. It was cleared that negative electromotive force occurred in elastic region as the deformation speed increased. The electromotive force turned to positive in plastic region. The peak value of electromotive force in tension increased linearly as the deformation speed increased.
Journal
- 年次大会講演論文集 : JSME annual meeting [List of Volumes]
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年次大会講演論文集 : JSME annual meeting 2003(6), 231-232, 2003-08-05 [Table of Contents]
The Japan Society of Mechanical Engineers