1834 電子機器熱設計ビルドアップアプローチ法 : RC 202 プロジェクト活動のアップデート  [in Japanese] The Build-up Approach for Thermal Design of Electronic Equipment : Update of RC202 Project  [in Japanese]

The RC202 JSME project work is in progress to implement a methodology called the Build-up approach (BUA). The BUA is designed to expedite thermal design of electronic equipment through hierarchical organisation of the design work. In the knowledge development level, the computational fluid dynamics (CFD) simulation is performed on a set of template designs. This paper explains the process to figure out important geometric parameters in the system box, then, make geometrically simpler models to facilitate further CFD studies. An example system has a model package on a PCB and several dummy components in a flat system box.