1835 ベンチマーク筐体内でファン空冷される P-BGA の熱流体解析  [in Japanese] CFD Simulation of Fan cooled P-BGA in the Benchmark Enclosure  [in Japanese]

The thermal resistance θ_<ja> of a plastic ball grid allay (P-BGA) which mounted on a low thermal conductive printed circuit board (PCB) in a enclosure and cooled by three exhaust fans was calculated by a CFD code. A small-scale c=e model of which enclosure and cabinet had the same configuration was used as a numerical model. When nothing less than one fan was operated, the θ<ja> of c=e model was insensitive to the range of heat transfer coefficient from 0 to 5 W/(m^2K) around the cabinet. However, when none of fans was operated, θ_<ja> of the c=e model was sensitive to it. Therefore the heat transfer coefficient should be determined in advance when none of fans were operated, by using a large-scale numerical model.