1836 筐体内でファン空冷される P-BGA の熱性能(筐体内充填率の影響)  [in Japanese] Thermal Performance of Fan Cooled P-BGA in the Enclosure(Effect of Volume Porosity in the Enclosure)  [in Japanese]

This paper presents the experimental results concerning the effects of packaging density to the thermal performance of a PBGA package model mounted on a printed circuit board enclosed in a thin compact casing. The casing has three compact fans and a copper heater, which simulates a PBGA package and is mounted on The printed circuit board. The thermal resistance values of the package are plotted against the ratio of the total obstacle volume to the casing volume and the ratio of the obstacle sectional area to the inlet area. The results demonstrate that the ratio of the obstacle sectional area to the inlet area is more effective than the ratio of the obstacle volume to the casing volume.