1838 閉ループ型熱サイフォンによる IC チップの間接的液体冷却に関する実験的研究  [in Japanese] An Experimental Study on Indirect Cooling of IC Chips using a Two Phase Closed Thermosyphon Loop  [in Japanese]

This paper reports on indirect cooling of high-power IC chips of notebook computers using a two phase closed thermosyphon loop with Fluorinert (FC-72) as the working fluid. The experimental set-up consists of an evaporator and a condenser connected by flexible tubing. The evaporator corresponds to a high-power IC chip, and the condenser represents a cooling plat located behind the display of notebook computer. The evaporator and the condenser have the outer dimensions of 50mm × 50mm × 20mm and 150mm × 200mm × 20mm, respectively. The experiments using several types of evaporators to enhance the boiling in the evaporator were carried out. It has been confirmed that the heater surface temperature for the evaporator with plate fin of roughness surface by blast (Type D) reduces about 18% in comparison with those for the evaporator without fin (Type A). In the case of the evaporator Type D, the temperature difference between the heater surface and ambient is kept around 55K for the highest heat input Q=30W in the present experiments.