スパッタ法ならびに蒸着法で作製したCu薄膜の初期成長過程  [in Japanese] Initial Growth of Cu Films Fabricated by Sputtering and Evaporation  [in Japanese]

Microstructural changes in the initial growth stage of Cu films fabricated by sputtering and evaporation are discussed. During and after deposition, the amplitude V of surface acoustic waves (SAWs) propagated on the piezoelectric substrate through the films deposited on it, and the electrical sheet resistivity of the films, R_<sq>, were measured. The surface morphology of the films was examined by using an atomic force microscope. As a result, it was found that (1) the critical thicknesses d_p, at which the islands of a film begin to percolate, and d_c, at which the film becomes two-dimensionally continuous, are smaller in sputter-deposited films than in evaporated ones; (2) the surface roughness of sputter-deposited films is smaller than that of evaporated films; and (3) microstructural change that increases the average interisland spacing is harder to achieve in sputter-deposited films than in evaporated ones.