パルス磁場を用いた単結晶シリコンの新規切断方法  [in Japanese] New Cutting Method of Single Crystal Silicon Using a Pulsed Magnetic Field  [in Japanese]

    • 金子 英雄 Kaneko H.
    • 信越化学工業(株)磁性材料研究所 Magnetic Materials R & D Center, Shin-Etsu Chemical Co.
    • 大橋 健 Ohashi K.
    • 信越化学工業(株)磁性材料研究所 Magnetic Materials R & D Center, Shin-Etsu Chemical Co.
    • 俵 好夫 Tawara Y.
    • 信越化学工業(株)磁性材料研究所 Magnetic Materials R & D Center, Shin-Etsu Chemical Co.

Abstract

A new cutting method using a pulsed magnetic field has been studied. A piece of single-crystal silicon is wound with a secondary coil, and is placed in a primary coil. When a currnet flows in the primary coil, the secondary coil shrinks in the radial direction. We succeeded in cutting the piece of singlecrystal silicon using that stress. The smaller the electric resistance of the coil, the larger the stress. The cross-sections of a silicon crystal cut by thus method has small radiant steps.

Journal

Journal of Magnetics Society of Japan   [List of Volumes]

Journal of Magnetics Society of Japan 23(4-2), 1477-1480, 1999-04-15  [Table of Contents]

The Magnetics Society of Japan (MSJ)

References:  4

You must have a user ID to see the references.If you already have a user ID, please click "Login" to access the info.New users can click "Sign Up" to register for an user ID.

Preview

Preview

Codes

  • NII Article ID (NAID) :
    110002810533
  • NII NACSIS-CAT ID (NCID) :
    AN0031390X
  • Text Lang :
    JPN
  • Article Type :
    ART
  • ISSN :
    02850192
  • NDL Article ID :
    4696566
  • NDL Source Classification :
    ZM35(科学技術--物理学)
  • NDL Call No. :
    Z15-398
  • Databases :
    CJP  NDL  NII-ELS