リニア電磁誘導式噴流はんだポンプの開発  [in Japanese] Linear Electromagnetic Pump for an Automatic Wave Soldering System  [in Japanese]

Abstract

A wave soldering system has been used for more than 50 years in the process of circuit board assembly, but the needs for maintenance-free operations, high solderability, and downsizing of the solder capacity have still not been met. To meet these requirements, the authors made practical use of a wave soldering system in which a direct thrust is applied to the molten solder by means of a linear electromagnetic pump, thus realizing maintenance-free system, a 1/10 to 1/20 reduction of the defect rate, and a 57% reduction of the solder capacity.

Journal

Journal of Magnetics Society of Japan   [List of Volumes]

Journal of Magnetics Society of Japan 23(4-2), 1701-1704, 1999-04-15  [Table of Contents]

The Magnetics Society of Japan (MSJ)

References:  6

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Cited by:  5

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Codes

  • NII Article ID (NAID) :
    110002810589
  • NII NACSIS-CAT ID (NCID) :
    AN0031390X
  • Text Lang :
    JPN
  • Article Type :
    Journal Article
  • ISSN :
    02850192
  • NDL Article ID :
    4697641
  • NDL Source Classification :
    ZM35(科学技術--物理学)
  • NDL Call No. :
    Z15-398
  • Databases :
    CJP  CJPref  NDL  NII-ELS