Two-Dimensional Thermal Stress Analysis of Surface Mount Joints under Uniform Temperature Change

• Nakagawa Fumito

• Nakano Yuichi

• Sawa Toshiyuki

抄録

This study deals with the thermal stress in a surface mount joint under uniform temperature change, where an upper element is mounted on a substrate and is ad-hesively bonded/soldered near both ends. The analytical approach is developed mainly in the case of a plane strain state and general solutions for the thermal stress and the strain distributions in the joint are derived using a two-dimensional theory of elasticity. It is shown by numerical calculations that the thermal stress is singular at both edges of the interfaces between the upper element and the adhesive, and between the substrate material and the adhesive. Maximum principal thermal stresses are examined in order to predict the fracture initiation point in different types of surface mount joints. In the experiments, the thermal stress distribution in an adhesive layer is measured using photoelasticity. In comparisons between the analytical results and the experimental ones, fairly good agreement is shown.

収録刊行物

• JSME international journal. Ser. A, Mechanics and material engineering

  JSME international journal. Ser. A, Mechanics and material engineering 38 (4), 425-432, 1995-10-15

  一般社団法人 日本機械学会

キーワード

• Elasticity
• Thermal Stress
• Surface Mount Joint
• Photoelasticity
• Thermoelastic Potential
• Dissimilar Materials

詳細情報

• CRID: 1390001205432218624
• NII論文ID: 110002964398
• NII書誌ID: AA10888746
• DOI: 10.1299/jsmea1993.38.4_425
• ISSN: 13408046
• Web Site: https://www.jstage.jst.go.jp/article/jsmea1993/38/4/38_4_425/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可