Frequency Domain Diakoptics for IC Packaging Structures Based on the PEE and FDTD Methods(Special Issue on Microwave and Millimeter-Wave Module Technology)

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This paper describes a diakoptics approach to the field simulation of shielded structures. If the structure can be divided so that the sliced cross section is homogeneously filled with a medium in the metal-surrounded region, the frequency domain diakoptics can be effectively formulated. In the method, the partial eigenfunction expansion(or modal expansion)is utilized at the interface between the divided structures, and the finite difference time domain calculation is used to characterize some of the divided parts. The synthesis of total characteristics is demonstrated using a simple example. The issue of term truncation in the eigenfunction expansion is also addressed and an effective algorithm for the term selection(mode selection)is proposed. The techniques described here are applicable to metal package designs for efficient structure optimization.

収録刊行物

  • IEICE transactions on electronics   [巻号一覧]

    IEICE transactions on electronics E81-C(6), 801-809, 1998-06-25  [この号の目次]

    一般社団法人電子情報通信学会

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各種コード

  • NII論文ID(NAID)
    110003211496
  • NII書誌ID(NCID)
    AA10826283
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    09168524
  • データ提供元
    CJP書誌  NII-ELS 
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