Contact Behaviors of New Material for Micro Relays

• TAMAI Terutaka

  Hyogo University of Teacher Education

• IDE Tatsumi

  NEC/TOKIN IWATE Corporation

抄録

Ag(40wt%)-Pd(60wt%) alloy has been widely applied to contact materials installed in various electromechanical devices. However, in application to the down sized relays, failure due to contact resistance is caused easily by both growth of oxide film on the contact surface and low contact force. To solve the increase in contact resistance, an overlay of thin Au or thin Au-Ag (8-10 wt%) has been used on the alloy. Despite this, cleanliness and low hardness of these overlays cause adhesion, or sticking, at contact interface. Increase in contact resistance and sticking afe contrary to each other. In order to eliminate these contrary properties, the author studied improving the Ag-Pd alloy with a dopant. Low level of contact resistance for both static and dynamic contacts of Ag-Pd with Mg doping was found even if the contact surface was covered with an oxide contaminant film. This paper presents the excellent contact resistance and adhesion behaviors of Ag-Pd-Mg alloy and their mechanisms, and also presents in the later part, surface contamination behaviors for organic gases.

収録刊行物

• IEICE transactions on electronics

  IEICE transactions on electronics 87 (8), 1235-1240, 2004-08-01

  一般社団法人電子情報通信学会

キーワード

• contact resistance
• adhesion
• sticking
• Ag-Pd-Mg alloy
• Ag-Pd alloy
• contact material
• micro relay

詳細情報

• CRID: 1573105977302130304
• NII論文ID: 110003214994
• NII書誌ID: AA10826283
• ISSN: 09168524
• 本文言語コード: en
• データソース種別:
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