低熱膨張フィルム光導波路を用いたOE-COF  [in Japanese] Opto-electronic chip-on-film packaging technology using low-CTE film waveguides  [in Japanese]

Abstract

光導波路フィルム上で光素子と電気素子を高密度集積し高速に動作させるOE-COF技術の確立を目的に、低熱膨張フィルム光導波路の開発とAuSnはんだバンプによる光素子接続を検討した。光導波路フィルムの光学特性、バンプ接続の強度、光素子と導波路コアとの位置合わせ、ともに十分な特性の得られることが分かり、OE-COF技術の実現性を確認した。

We have developed a new type of polyimide optical waveguide film with a low coefficient of thermal expansion(CTE). Using the low-CTE polyimide waveguides and AuSn microsolder bump bonding technology, we made a prototype optical transmitter submodule. We measured the optical properties of the film waveguides, the shear strength of the bonds, and the alignments between the optical chips and the waveguide cores, and found the opto-electric chip-on-film package can be realized using these technologies.

Journal

Technical report of IEICE. OPE   [List of Volumes]

Technical report of IEICE. OPE 101(260), 31-34, 2001-08-17  [Table of Contents]

The Institute of Electronics, Information and Communication Engineers

References:  3

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Codes

  • NII Article ID (NAID) :
    110003303560
  • NII NACSIS-CAT ID (NCID) :
    AN10442691
  • Text Lang :
    JPN
  • Article Type :
    ART
  • ISSN :
    09135685
  • NDL Article ID :
    5908374
  • NDL Source Classification :
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No. :
    Z16-940
  • Databases :
    CJP  NDL  NII-ELS 

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