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Micro-parallel seam joining equipment provided with multiple functions was newly developed based on experimental results as previously reported to facilitate establishment of seam joining conditions over a wider range for hermetic sealing of ceramic packages of a highly reliable integrated circuit which are becoming larger in size and diversified. It has also enabled the reinforcement of product quality assurance system as regards hermeticity, seam joining strength and package temperature rise. Listed below are the major functions. (1) In order to prevent damaging of the lid due to misalignment or improper positioning of package and lid, an in-process displacement monitor was developed and its calculated performance was achieved. (2) The equipment was systemized with use of CPU whereby complex seam joining conditions can be easily entered and they can be verified as well as stored. (3) Introducing a travelling mechanism which is able to travel to any location on the work table, the ranges of seam joining head travel (X Axis) and work table travel (Y, Theta Axis) were expanded by a factor of 1.5 to 3 as compared with the experimental equipment and the positioning accuracy was improved by a factor of 1/10. (4) A desired distance can be designated on any axis of X, Y and Theta and travelling can be allowed under the same joining condition changed for that designated distance (Pitch Feed Function). As a result, prevention of splash generation around the corner section of a specially shaped package was achieved as well as suppression of package temperature rise. At the same time, formation of reactive layer due to Au- and Ni-plated layer melting together was positively achieved at the joining boundary of lid and seal frame and specified hermeticity and joining strength were secured.