Convective Heat Transfer from a Multichip Module with Different Chip Spaces to PCM Slurry Flow in a Rectangular Channel

The objective of the present study was to investigate the effect of a chip spacing in a multichip module on the cooling characteristics of phase change material slurry. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynold number. The removable that flux at the same chip surface temperature decreased as the chip spacing decreased. The local heat transfer coefficients for the parafin slurry were larger than those for water, and the chip spacing on the local heat transfer coefficient for paraffin slurry influenced less than that for water. The enhancement factor for the paraffin slurry showed the largest value at a mass fraction of 5% rregardless of the chip spacing, and the enhancement factors increased as the chip spacing decrased. This means that the paraffin slurry is more effective than water for cooling of the highly integrated multichip module.