Parametric Study on the Thermal Response of Electronic Components during Infrared Reflow Soldering

A numerical study is performed to predict the thermal response of a card assembly during infrared reflow soldering to attach electronic components to a printed circuit board. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to analyze the sensitivity of the thermal response of electronic components to various conditions such as conveyor speed, exhaust velocities and emissivities. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions such as infrared panel heater temperatures, conveyor speed, and exhaust velocity for each card assembly to ensure proper soldering and minimization of thermally induced card assembly stresses.