Preparation of (Ba, Sr)TiO<sub>3</sub> Thin Films by Chemical Vapor Deposition Using Liquid Sources

  • Kawahara Takaaki
    Semiconductor Research Laboratory, Mitsubishi Electric Corporation, 8–1–1 Tsukaguchi Honmachi, Amagasaki, Hyogo 661
  • Yamamuka Mikio
    Semiconductor Research Laboratory, Mitsubishi Electric Corporation, 8–1–1 Tsukaguchi Honmachi, Amagasaki, Hyogo 661
  • Makita Tetsuro
    Semiconductor Research Laboratory, Mitsubishi Electric Corporation, 8–1–1 Tsukaguchi Honmachi, Amagasaki, Hyogo 661
  • Tsutahara Koichiro
    Kita–Itami Works, Mitsubishi Electric Corporation, 4–1 Mizuhara, Itami, Hyogo 664
  • Yuuki Akimasa
    Semiconductor Research Laboratory, Mitsubishi Electric Corporation, 8–1–1 Tsukaguchi Honmachi, Amagasaki, Hyogo 661
  • Ono Kouichi
    Semiconductor Research Laboratory, Mitsubishi Electric Corporation, 8–1–1 Tsukaguchi Honmachi, Amagasaki, Hyogo 661
  • Matsui Yasuji
    Semiconductor Research Laboratory, Mitsubishi Electric Corporation, 8–1–1 Tsukaguchi Honmachi, Amagasaki, Hyogo 661

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  • Preparation of (Ba, Sr)TiO3 Thin Films by Chemical Vapor Deposition Using Liquid Sources

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Thin films of (Ba, Sr)TiO3 with high dielectric constant were prepared on Pt/SiO2/Si substrates of 6-inch-diameter by chemical vapor deposition using liquid sources. Ba(DPM)2 and Sr(DPM)2 dissolved into tetrahydrofuran were vaporized in a vaporizer at 523 K, and Ti(O-i-C3H7)4 was bubbled at 313 K. The mixture of the source vapors with O2 and N2O was supplied to the reactor (10 Torr) at uniform velocities through a shower-type nozzle, which realized uniform profiles in the deposited film thickness and composition. The electrical properties are significantly influenced by the film composition, and the typical properties obtained for a 800-Å-thick film prepared at the substrate temperature of 823 K are an equivalent SiO2 thickness t eq of 5.2 Å, a leakage current J L of 2.4× 10-6 A/cm2 (at 1.65 V), and a dielectric loss tan δ of 0.07.

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