Transport and Deposition Processes of Sputtered Particles in RF-Microwave Hybrid Sputtering Discharges (<Special Issue> Plasma Processing)

• TUDA M.

  Semiconductor Research Laboratory, Mitsubishi Electric Corporation

• ONO Kouichi

  Semiconductor Research Laboratory, Mitsubishi Electric Corporation

• YUUKI Akimasa

  Semiconductor Research Laboratory, Mitsubishi Electric Corporation

収録刊行物

• Jpn. J. Appl. Phys.

  Jpn. J. Appl. Phys. 33 4473-4477, 1994

  社団法人応用物理学会

キーワード

• sputter deposition
• step coverage
• Monte-Carlo simulation
• transport of sputtered particles
• hybrid discharge

詳細情報

• CRID: 1573668927153514752
• NII論文ID: 110003903799
• NII書誌ID: AA10457675
• 本文言語コード: en
• データソース種別:
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