Reactive Ion Beam Etching Using a Broad Beam ECR Ion Source

この論文をさがす

抄録

<jats:p> A broad beam ion source using a microwave electron cyclotron resonance (ECR) discharge has been newly developed, giving high reliability in operation. The ion source operates at gas pressures higher than about 3×10<jats:sup>-5</jats:sup> Torr, and an ion current density of 1 mA/cm<jats:sup>2</jats:sup> is obtained at an ion extraction voltage of 1000 V. By introducing C<jats:sub>4</jats:sub>F<jats:sub>8</jats:sub> and SiCl<jats:sub>4</jats:sub> into the ion source, SiO<jats:sub>2</jats:sub> and Al are etched at rates greater than 1000 Å/min, with high selectivities and high-accuracy pattern transfer. </jats:p>

収録刊行物

被引用文献 (56)*注記

もっと見る

参考文献 (10)*注記

もっと見る

詳細情報 詳細情報について

問題の指摘

ページトップへ