Measurement of Thermal Diffusivity of Transparent Adhesives by Photoacoustic Microscope.

• Tokunaga Yoshiaki

  Department of Electrical Engineering, Kanazawa Technical College, 2–270 Hisayasu, Kanazawa 921, Japan

• Minamide Akiyuki

  Department of Electrical Engineering, Kanazawa Technical College, 2–270 Hisayasu, Kanazawa 921, Japan

• Nakada Naotaka

  Department of Electrical Engineering, Kanazawa Technical College, 2–270 Hisayasu, Kanazawa 921, Japan

抄録

In this paper, we describe a method by which thermal diffusivity of transparent epoxy adhesive on a substrate can easily be measured from the frequency dependence of a photoacoustic (PA) signal. In order to eliminate the influence of the substrate, the phase difference between a PA signal of the adhesive on the substrate and a PA signal of only the substrate was measured. This method was tested for cases of thermally thin and thick graphite (high thermal conductivity) substrates and a polypropylene (low thermal conductivity) substrate. It has the advantage that the thermal diffusivity of a transparent adhesive on a substrate can be measured regardless of the thickness and the thermal properties of the substrate.

収録刊行物

• Japanese Journal of Applied Physics

  Japanese Journal of Applied Physics 34 (5B), 2900-2903, 1995

  The Japan Society of Applied Physics

キーワード

• photoacoustic microscope
• transparent adhesive
• thermal diffusivity
• nondestructive testing
• epoxy resin
• thermal wave impedance
• frequency dependence measurement

詳細情報

• CRID: 1390282681222813056
• NII論文ID: 110003955046
• NII論文ID: 130004521429
• NII論文ID: 210000037408
• NII書誌ID: AA10457675
• DOI: 10.1143/jjap.34.2900
• ISSN: 13474065
• ISSN: 00214922
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.34.2900
• Web Site: https://iopscience.iop.org/article/10.1143/JJAP.34.2900/pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可