実験計画法を用いたボンディングワイヤループ形状適正化の検討(J01-4 最適構造設計,J01 エレクトロニクス実装における熱制御および信頼性評価)

• 河野 賢哉

  日立機械研

• 小西 聡

  ルネサス

• 遠藤 恒雄

  ルネサス

• 飯塚 守

  ルネサス

• 三浦 英生

  東北大

書誌事項

タイトル別名

• Optimization of Loop-shape of a Bonding Wire using Design of Experiments

抄録

A method for evaluating fatigue life of the bonding wires in semiconductor packages under a temperature cycling test was studied analytically using a finite element method based on design of experiments. The sensitivity analysis of the maximum strain occurs in a bonding wire was carried out to make clear the effect of the loop-shape of the wire on the strain. It was found that we can evaluate the fatigue life of a bonding wire under various conditions of a temperature cycling test at the early stage of design by using both the Chebyshev function of a loop, shape factor and the Manson-Coffin fatigue life curve. It was also found that highly reliable loop shape of the wire can be designed by minimizing the strain using design of experiments.

収録刊行物

• 年次大会講演論文集

  年次大会講演論文集 2004.6 (0), 49-50, 2004

  一般社団法人 日本機械学会

キーワード

• Structural Reliability
• Fatigue Life
• Design of Experiments
• Finite Element Method
• Bonding Wire
• Electronic Package

詳細情報

• CRID: 1390282681037898240
• NII論文ID: 110004069244
• DOI: 10.1299/jsmemecjo.2004.6.0_49
• ISSN: 24331325
• Web Site: https://www.jstage.jst.go.jp/article/jsmemecjo/2004.6/0/2004.6_49/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可